Fraunhofer Institute for Reliability and Microintegration IZMAg sintering of large areas
Fig. 1
Large-area silver sintering between metallized ceramic substrates and a transfer cooler is suitable for achieving the highest possible thermal conductivity while maintaining a long service life. Investigations on simple samples, a sandwich of Cu and AlMg3 (see Figure 1), have shown that fatigue cracks propagate much more slowly than in solder joints. The minimum crack propagation after 1000 temperature cycles can be easily seen at the corners in the ultrasonic image in Figure 2. A scanning electron micrograph of a transverse section of the Ag sintered joint is shown in Figure 3.
