Equipment

Qualification and Test Center (QPZ)

Reliability testboard with LTCC-BGA and microvias

Reliability testboard with LTCC-BGA and microvias

In the framework of the Quality and Test Center (QPZ) for electronic assemblies we offer:

  • Failure analyses of electronic assemblies
  • Failure analysis of LED packages
  • Solderability and wettability analysis
  • Acceptability of electronic assemblies
  • Microstructure analysis of solder joints
  • Surface analysis using XPS
  • X-ray, C-SAM, CT, FIB, SEM
  • Reliability testing and analysis
  • Reflow soldering processes
  • Void-less soldering
  • SIR, Electromigration