Qualification and Test Center (QPZ)
![Reliability testboard with LTCC-BGA and microvias](/en/abteilungen/system_integrationinterconnectiontechnologies/ausstattung/qualifikations-_undpruefzentrumfuerbaugruppenqpz/jcr:content/contentPar/sectioncomponent/sectionParsys/textblockwithpics_44/imageComponent1/image.img.jpg/1448520128646/Titel-testboard-qpz.jpg)
Reliability testboard with LTCC-BGA and microvias
In the framework of the Quality and Test Center (QPZ) for electronic assemblies we offer:
- Failure analyses of electronic assemblies
- Failure analysis of LED packages
- Solderability and wettability analysis
- Acceptability of electronic assemblies
- Microstructure analysis of solder joints
- Surface analysis using XPS
- X-ray, C-SAM, CT, FIB, SEM
- Reliability testing and analysis
- Reflow soldering processes
- Void-less soldering
- SIR, Electromigration