Die and Wire Bonding for High Frequency Applications
Electrical connections for microelectronic high frequency components require short signal paths and a very high placement accuracy at pad dimensions, which are often very small, in order to achieve the maximum possible operation frequency. Wedge/wedge-bonding with 25 µm Au wire and pitches < 50 µm allows for frequencies of up to 30 GHz with loop lengths of up to 500 µm and loop heights below 200 µm. Frequencies of more than 30 GHz require the use of Au ribbons at further reduced loop lengths and heights. Technologies and know how therefore are available in the group COB and power technologies.