Fraunhofer Institute for Reliability and Microintegration IZMDiebond, pick and place
High precise Diebonder 4501 from Delvotec
PI-Hexapod for active alignment
Picking, placing and assembling various components belong to the basic tasks in microelectronics and microsystem technology. The equipment available at Fraunhofer IZM includes the individual highly precise active alignment of components (better than 1 µm) in six axes to a fully automatic assembly under industrial conditions. Numerous adhesive and soldering processes are applied for interconnection.