Process and Product Development

Wire Bonding

Chip hoher Anschlussdichte
Chip hoher Anschlussdichte
Bändchenbonds
Bändchenbonds

Qualification of surfaces with regard to bondability (bond testing), assembly of prototypes and small series, feasibility studies, process development, technological advice, schoolings. Fully automatic wire bonding, production under laboratory and manufacturing conditions. Wire diameters from 17,5 – 500 µm, wire materials: Al, AlSi1, Au, AuPd1, Cu, Pd Procedures: Ball/Wedge, Wedge/Wegde, ribbon, heavy wire, studbumps Options: fine wire/fine pitch bonding, low/short/long loop bonding, deep access bonding.