Process and Product Development


Soldering materials to create solid-state  bonds is a technique that dates back thousands of years. Even today, soldering is the most popular means of interconnecting electronic components. In the electronic packaging industry, the process is applied at all levels of integration, from interconnection between the chip and housing and/or wiring (1st level packaging), to interconnection between the 1st level package and the carrier and/or any additional components (2nd level packaging).

Research & development

Fraunhofer IZM is currently pursuing the following research and development in this area:

  • Reflow soldering
  • Soldering of thin die attach solder joints
  • Transient liquid phase bonding
  • Self-aligning flip-chip bonding
  • Miniaturized solder joints
  • Solder for hermetic seals
  • System-in-package and 3D-integration

more info

Methods and equipment

Fraunhofer IZM uses both destructive and non-destructive analysis techniques to assess solder joints. Specific tests include micro-sampling, light microscopy, SEM, EDX analysis and focused ion beam (FIB). Reliability is evaluated by lifetime, temperature cycling and electromigration analysis. We also evaluate the quality of solder by analyzing its wetting properties and the pad quality, which are critical in preventing voids and other joint defects.

Fraunhofer IZM helps technology and product developers with:

  • Selecting the appropriate metallization
  • Solders and solvent application
  • Quality assurance
  • Void-free solder processing
  • Technology forensics

The institute has a wide range of facilities and equipment available for selective, plasma, vapor-phase and convection soldering.