Research and Development
Our research and development into sintering is currently dominated by the following topics:
- Large-surface sintering: Joining by sintering is currently in particular demand for “first-level” (die attach) applications. In the future, sintering is also planned for significantly larger surfaces, such as cooling bodies.
- Optimization of sintering under reduced pressure: Pressure-assisted sintering processes are used commercially. Here, up to 30 MPa is applied to the electronic components. One aim is manufacturing sinter layers of low porosity using significantly reduced pressure (< 1 MPa), or developing a process that does without any pressure.
- Sintering of SMD-compatible components: To date, sintering is only used for the die attach of power semiconductors. Especially for high-temperature applications, developers are trying to adapt silver sintering for component assembly (resistors, diodes, spools, LEDs, ICs).
- Extending sintering to non-noble metal surfaces in controlled atmospheres: Presently, oxide-free, noble metal (Ag or Au) surfaces are an important prerequisite for ensuring the sinter layer is reliably joined to the component or substrate. As this often necessitates an additional plating step, a key aim is developing sintering processes suitable for non-noble metal surfaces such as copper.