Testing, Qualification, Reliability

Failure Analysis SMD

Failure of a CSP-solder joint
Failure of a CSP-solder joint
Cracked plated through hole
Sleeve crack on an LP through-hole plating

SMD failure analyses comprehend analyses in the context of impaired PCB solderability, early failures of plated-through holes and microvias as well as investigations of failed solder joints after field stress. Starting with optical inspection and x-ray microscopy the following methods are applied:

  • Metallographic cross sectioning
  • Reflected light microscopy for structure evaluation
  • SEM/EDX analysis of intermetallic phases
  • Focused Ion Beam (FIB) target preparation

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Robustness and Life
Cycle Assessment