3D Chip Stack

Exhibit by IZM-ASSID

Sub-Micron X-ray Tomography for 3D TSV Stacking (in cooperations with members and partners of "Dresden Fraunhofer Cluster Nanoanalysis")

3D Flip Chip stack of 1+9 TSV test devices (thickness: 100 µm)

SnAg interconnect structures

Minimum interconnect pitch spacing: 55 µm

Minimum distance between two stacked chips: 30 µm

placement accuracy: 3µm@3Sigma for a maximum chip size of 20 x 20 mm²

Used underfill technologies: capillary- as well as pre-applied-underfill