Silicon Interposer Test Wafer with HF Structures

Exhibit by IZM-ASSID

  • Silicon interposer test wafer with front- and backside patterning, sample 50x80 mm
  • Copper filled TSVs 10x100 µm
  • 1 frontside, 1backside metal layer
  • Polymer RDL with 3µm copper and 5 µm WPR
  • HF test structures dedicated for material characterization up to 110 GHz
  • In cooperation with DFG - German Research Foundation