Fraunhofer Institute for Reliability and Microintegration IZMFan-out refers to embedding chips in a mold compound to produce reconfigured wafer substrates and applying wafer-level technologies. This technology not only offers solutions for equalizing the solder contacts of individual chips, but also provides an approach for integrating heterogeneous chip types in a package with maximum contact density in a very small space.
Your partner for fan-out wafer-level packaging
Fraunhofer IZM is one of the leading research institutions in the field of fan-out wafer-level packaging and has a comprehensive process landscape covering all modern forms of this technology. The focus is on the development of high-performance, miniaturized, and heterogeneously integrated electronic systems, which are realized through reconfigured wafer structures and high-precision redistribution layers (RDL).
IZM is one of the few institutes that has demonstrated both Chip 1st /Mold 1st approaches and sophisticated RDL-1st processes on an industrial scale. This combination opens up a high degree of technological flexibility and allows the implementation of a wide variety of packaging architectures for sensor technology, power electronics, RF modules, HPC, or IoT systems.
Technological flexibility for maximum applications
The work carried out by IZM covers a wide range of demanding applications. These include RF modules for 5G and mmWave technologies, the integration of power semiconductors such as GaN and GaAs ICs, and fan-out-based system-in-package solutions, including the integration of cooling concepts. MEMS and sensor systems have been successfully embedded in fan-out structures, using special process variants to protect sensitive surfaces and ensure reliable packages. 3D packaging solutions are implemented in fan-out solutions using through mold vias (TMVs) or Through package vias (TPVs).
Everything from a single source
At Fraunhofer IZM, companies benefit from a complete process chain from a single source – from design support, molding, RDL manufacturing, and assembly to comprehensive reliability characterization. The institute offers customer-specific developments as well as prototyping and small-batch production, provides support in material and process selection, and implements projects in an industry-relevant environment. All in all, Fraunhofer IZM offers a powerful and broad range of services that sets the standard for modern electronics development and heterogeneous integration.
