Universal Sensor Platform - USeP

Universal Sensor Platform - USeP

Main focus of this project is a universal sensor platform. For the development of this USeP sensor package, state of the art technologies of the partners GlobalFoundries and several Fraunhofer Institutes is utilized. The package has two parts: one can be produced in advanced and includes basic core elements such as processor, memory or battery. In the second part, individually selectable sensors are included. The division of realizing constant components on the one hand and flexible components on the other hand allows for the first time a fast production of specifically adapted sensor systems with highest performance. This concept aims especially at small and medium enterprises offering them an essential market advantage.

For the USeP package, Fraunhofer IZM-ASSID is developing integration technologies for the wiring of the SOCs (RDL first approach) and the package (tall copper pillars respectively TMV: through mold vias).

For the assembled packages, Fraunhofer IZM in Berlin is developing a capping technology based on thermocompression molding. After the exposure of the TMVs, then a reliable and pre-produceable package is available. The wiring of the second package part is structured flexibly via laser direct imaging. The wiring is contacting the exposed TMVs of the package and contains customer defined individual sensor configurations.