Worldwide Network

The “International Technology Roadmap for Semiconductors”, initiated in the US, is sponsored by the five leading chip manufacturing regions in the world: Europe, Japan, Korea, Taiwan, and the United States. It consists of 15 working groups in which scientists from different countries meet regularly (e.g. each year during Semicon West in San Francisco, USA) to work on ensuring cost-effective advancements in the performance of the integrated circuit and the products that employ such devices.

Fraunhofer IZM’s expertise is represented by M. J. Wolf in the working group Assembly & Packaging. Wolf, head of the Fraunhofer IZM All Silicon System Integration Center ASSIS in Dresden, is actively involved in the advancement of near-term assembly and packaging roadmap requirements and the introduction of new requirements and potential solutions to meet market needs in the longer term.