Fraunhofer Institute for Reliability and Microintegration IZM
Fraunhofer Institute for Reliability and Microintegration IZM

In-process measurement technology for high-throughput vacuum metallization processes on wafers with diameters of up to 300 mm for Advanced Heterogeneous Packaging Applications in the Fields of Filters and Power Electronics

Project MetroPro

Overview

The goal of this collaborative project is to develop non-contact, in-situ measurement solutions for the electrical properties of metal layers. Applications include semiconductor engineering, quantum technology, and communications technology. The project enables Saxon companies and R&D institutions to establish a unique competitive position on the international stage and ensures value creation in Saxony with regard to the manufacture of measurement systems and the resulting technological development.

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Subproject: In-process metrology of high-throughput vacuum metallization processes on wafers up to 300 mm in diameter

The goal is to develop non-contact and non-destructive measurement techniques for determining the thickness of ultrathin metal layers in the nanometer range. These layers are deposited on 300 mm wafers using the so-called PVD process in fully automated production systems.

  • Development of in-situ measurement technology for the deposition of thin metal layers in a vacuum system
  • Fundamental investigations into the relationships between the measurements and application-specific layer properties for applications in thin-film technology
  • Principle of eddy current measurement

  • SURAGUS GmbH
  • Fraunhofer Institute for Electron Beam and Plasma Technology FEP

General Project Informationen

  • Duration: 01.05.2025 - 31.12.2027
  • Funding Program: SAB / EFRE 
  • Grant reference Number: 100767884

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