Project NewWAVE - Fraunhofer IZM

Overview

Heterogeneous 2.5D and 3D integration is key to boosting the performance of modern microelectronics in extremely compact spaces. Complex structures consisting of thin chips, chiplets, and interposers enable the combination of different semiconductor materials in a highly integrated package. Within the NewWAVE project IZM-ASSID invests in an innovative, liquid-assisted laser cutting process that opens up new possibilities for processing at the 300 mm wafer level. The new system aims for the singulation of heterogeneous substrates made of Si, low-k dielectrics, glass, SiC, etc., with thicknesses of up to 1000 μm can be separated with high-quality, very narrow saw lines (down to < 20 μm width) with minimal particle and defect generation.

The project lays the foundation for novel high-density integration technologies in advanced packaging for future applications such as high-performance computing, AI, and quantum computing.

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Fraunhofer IZM Research Focus

Acquisition and integration of a novel laser dicing system as a technological foundation for future wafer singulation processes
Enabling a universal single-step dicing process for complex and heterogeneous wafer materials
Expansion of technological infrastructure for advanced materials such as glass, low‑k dielectrics, and compound semiconductors
Improvement of process stability, edge quality, and device reliability as a basis for downstream packaging technologies
Establishment of a platform for subsequent process development and industrial applications (e.g., within the WAVE4Tech project)