Fraunhofer Institute for Reliability and Microintegration IZMIncreasing the reliability of electronic assemblies by improving the prediction of the aging resistance of potting compounds and adhesives under cyclic thermal stress
Electronic assemblies are used in many applications for controlling and monitoring. In the manufacture of such assemblies, critical electronic components are joined by bonding, for instance, and the assembly is protected from environmental influences with the aid of potting compounds. The requirements for reliability and durability are very high, especially for safety-relevant components.
The aim of the project is to develop a method for reliably predicting the influence of ageing on electronic components and to set it down in an easy-to-use guideline, which will be made available as the basis for a DVS information sheet after the project has been completed.
