Fraunhofer Institute for Reliability and Microintegration IZMAPPLAUSE ECSEL
Developing packaging and interconnection technologies for the competitive production of highly integrated microelectronic and optoelectronic systems.
Projects
Project information
Duration: 10/01/2020 - 04/31/2020
Project website: https://www.elektronikforschung.de/projekte/applause
Project Partners
- DustPhotonics
- albis
- Almae