CeCaS – Supercomputing platform for fully automated vehicles

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© CeCaS

In the car of the future, the industry faces the challenge of combining safety and maximum performance of the computer systems installed in the car. The CeCaS (CentralCarServer) research project aims to develop a corresponding supercomputing platform for highly automated vehicles. The aim is to manage complex calculations and the handling of large amounts of data in the car. The project is researching new approaches in microelectronics, computing and software architecture in order to be flexible and efficient. Fraunhofer IZM is contributing its expertise in the packaging of central car server chiplet modules on organic interposers. Our researchers are developing flip-chip assembly concepts and thermal interfaces for sustainable, scalable cooling concepts for this complex central car server. Derived from the research work on packaging, contributions are being made to the digital twin for the reliability assessment of chiplet-based electronic modules. The aim is to create heterogeneous computer structures that are highly efficient and made robust against interference by means of adapted assembly and connection technology and suitable cooling methods.

Project information

Duration: 12/2022 – 11/2025

Funding reference number: 16ME0800K

Project website:  


CeCaS is funded by the Federal Ministry of Education and Research (BMBF) with 46.2 million euros as part of the MANNHEIM research funding guideline ("Electronics and software development methods for the digitalization of automobility").

Projekt Partners

Bosch, Continental Automotive, ZF Friedrichshafen, Hella, AVL Software & Functions, Ambrosys, Infineon Technologies AG (coordination; with Infineon Technologies Dresden GmbH & Co. KG and Infineon Technologies Semiconductor GmbH), Kernkonzept, Berliner Nanotest und Design, Missing Link Electronics, Inchron, Glück Engineering, STTech, Steinbeis ZFW, Swissbit Germany, Karlsruhe Institute of Technology (KIT), FZI Research Center for Information Technology, Technical University of Munich (AIR, LIS and SEC), Munich University of Applied Sciences, Universität zu Lübeck, Chemnitz University of Technology, Fraunhofer ENAS, IMWS, IPMS and IZM.


Working Group

Assembly and Encapsulation

We research integration technologies for system-in-package products, focusing in particular on device assembly for highly integrated packages and joining/encapsulation processes based on polymeric materials.


Feature Topic


The evolution of CPUs and GPUs, packing ever more computing power into ever smaller packages, is inexorably nearing its commercially viable and, soon, physical limits. Chips are still expected to become faster with every generation, but the rate of growth is already slowing. As the technology’s evolution is coming up to this crossroads, chiplets represent the future of processors.