Section through a glass interposer
© Fraunhofer IZM
Section through a glass interposer

The GlaRa project develops a high-reliability technology platform that combines sensor systems with high-speed signal processing and high-frequency data transmission.

Project consortium: Glass interposer technology for extremely compact high-frequency electronics applications - GlaRA.

Sub-Project: Through-via and cavity wiring on glass substrates

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Project Partners

  • LPKF Laser & Electronics AG
  • Endress + Hauser GmbH & Co. KG
  • Pac Tech GmbH
  • Sentronics Metrology GmbH
  • MSG Lithoglas GmbH


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High-frequency Technology Entirely in Glass

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