Realizing Trustworthy Complex Systems with Wafer-Level Packaging


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May 1, 2021, was the launch day of the three-year project “Realizing Trustworthy Complex Systems with Wafer-Level Packaging - VE-REWAL”, led as a combined effort by the University of Bremen’s Institute for Theoretical Electrical Engineering and Microelectronics. The project intends to explore concepts for a platform for trustworthy electronics with a novel system partitioning approach, suitable system packaging technology, and secure communication between the system’s components. A 77GHz-Radar MIMO application was chosen as test case for a chiplet design for radar ICs, investigated in FOWLP form, as a complete assembly, and in active use.

Fraunhofer IZM’s Project Focus
Fraunhofer IZM has committed itself to the sub-project “RDL-1st for Trusted Chiplet Packaging”. The Institute’s WLSI, SIIT, and ERE units are contributing to the further development of essential processing phases for the RDL-1st technology in FOWLP applications and to the construction of a working 77GHz radar system for automotive applications using the proposed technology. The process development efforts are aimed in particular at an evaluation and characterization of new materials for the release layer, spin-on dielectrics and mold compounds, and a systematic investigation of high-density wiring through reduced track widths and spacing, smaller via diameters, and additional routing layers. These efforts are supported by electrical (RF) and thermomechanical simulations to help construct and validate the proposed models and by an evaluation of possible failure modes under stress.

Logo - Federal Ministry of Education and Research (BMBF)

Project Partners

  • UNI Bremen
  • Conti Temic Microelectronic GmbH
  • Fraunhofer (FHR, IZM)
  • TU Ingolstadt, Ruhr-Universität Bochum
  • Infineon Technologies AG
  • PHYSEC GmbH (assoziierter Partner)

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