Packaging of ultra-dynamic photonic switches and transceivers

Project PUNCH

Overview

New optical switches can speed up the backbone of our data networks. The EU-funded PUNCH project will develop a new solution for optical switching that addresses several industrial requirements, including reliable and low latency communication with guaranteed service quality, less network congestion (and data loss or delay), lower power consumption and reduced cost of transmission interfaces. To do so, PUNCH will develop novel photonic components and corresponding interface electronics, establish scalable integration and photonics packaging processes, and manufacture different prototypes which will be demonstrated and validated in industrial 5G and data centre test-beds.

Fraunhofer IZM is focussing on the development of heterogeneous fan-out wafer level packaging (FOWLP) that integrates photonic integrated circuits (PICs) and electronic integrated circuits (ICs) in a single package.

  • Fraunhofer-Institut für Zuverlässigkeit und Mikrointgration IZM 
  • IMEC (Project coordinator)
  • Phix BV
  • Mellanox Technologies Ltd.
  • Ericcson
  • AT&S
  • Nvidia
  • University of Cambridge
© image rights: Fraunhofer IZM | Volker Mai
Development of heterogeneous fan-out wafer level packaging (FOWLP) that integrates photonic integrated circuits (PICs) and electronic integrated circuits (ICs) in a single package.

General Project Information

  • Duration: 01.09.2022 – 31.08.2026
  • Funding program: Horizont Europa
  • Funding code: 101070560

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