Staff / Head of the Department Ivan Ndip

Ivan Ndip

Contact Press / Media

Dr.-Ing. Dr.-Ing. habil. Ivan Ndip

Head of the Department

Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Gustav-Meyer-Allee 25
13355 Berlin

Phone +49 30 46403-679

Competencies and Tasks

Ivan Ndip joined Fraunhofer IZM Berlin in 2000, and worked as a Student Research Assistant in the RF Modeling & Simulation Group until 2002. From 2002 to 2005, he worked as a Research Engineer at IZM, and at the Chair for High-Frequency Electronics, University of Paderborn. During this period, he proposed, and laid the foundation of, a holistic and cost-effective RF system design approach called the M3-approach (methodologies, models and measures). The M3-approach leads to optimized design of high-frequency and high-speed components, modules and systems without re-design iterations.

In June 2005, Ivan was appointed as the Manager of the RF Modeling & Simulation Group at IZM. In 2006, he established the RF & High-speed System Design Group, and led this group until 2015. While serving as Group Manager from 2005 to 2015, he built-up a dynamic team of RF engineers/scientists at IZM, and led a multitude of R&D projects with national and international partners that focused on the application of the M3-approach for design and optimization of RF/high-speed packages, RF components, modules and systems, especially for high-speed telecommunication network infrastructure, wireless communication and radar sensing applications. Since 2014, he has been the Head of the Department of RF & Smart Sensor Systems at IZM, where he directs R&D activities in five research groups, and manages the Department. He has been a Lecturer with the School of Electrical Engineering and Computer Sciences, Technische Universität (TU) Berlin, since 2008. He also teaches Professional Development Courses (PDCs) to practicing engineers and scientists worldwide.

Ivan has authored and coauthored more than 175 publications in referred journals and conference proceedings. He is an inventor, and holds many US and German patents and patent applications. He is a recipient of numerous best paper awards as well as a recipient of the Tiburtius-Prize (Preis der Berliner Hochschulen), awarded yearly for outstanding Ph.D. dissertations in the State of Berlin. In 2012 he received the Fraunhofer IZM Research Award for his work on the development and successful application of novel methodologies, models, and design measures (M3-approach) for optimization of high-frequency and high-speed systems. In 2016 he received the John A. Wagnon Technical Achievement Award from the International Microelectronics Assembly and Packaging Society (IMAPS) for his outstanding technical contributions to the microelectronics industry worldwide.

Ivan currently drives research on 5G mobile communication at IZM. He leads numerous R&D projects on the development of 5G mmWave hardware components and modules with German, European, US and Asian-based Firms.

Ivan is a Fellow and Life Member of IMAPS, as well as a Senior Member of IEEE. Since 2016, he has been serving as Director in the IMAPS Executive Council. He is a member of the Technical Program Committee of many IEEE and IMAPS international conferences/symposia. He served as Technical Co-Chair, Technical Chair and General Chair of many IMAPS International Symposia on Microelectronics in USA, as well as General Chair of IEEE Workshop on Signal and Power Integrity (SPI). He is a reviewer of the Nature Communications Journal and many IEEE Journals. He also serves as an Associate Editor of the Journal of Microelectronics and Electronic Packaging.

Ivan studied electrical engineering at TU Berlin. He received the Dipl.-Ing. (M.Sc.) degree, and the Dr.-Ing. degree (Ph.D.) with the highest distinction (summa cum laude), in electrical engineering from TU Berlin in 2002 and 2006, respectively. From 2007 to 2017, he pursued the habilitation, and carried out extensive post-doctoral research on optimized design of miniaturized mmWave and terahertz (THz) systems for future wireless communication and radar sensing applications. His research focused primarily on mmWave and THz 3D antenna configurations; new antenna modeling, measurement and analysis methods; novel high-frequency system-packaging architectures and system-integration structures for integrating antennas and transceiver components as well as design methodologies for improved signal integrity, power integrity and intra-system electromagnetic compatibility (EMC). In 2017, he completed the habilitation, and received the Dr.-Ing. habil. degree (a higher doctorate) in electrical engineering from the Brandenburg University of Technology, Cottbus-Senftenberg, Germany.

Awards (Selected)

  1. Best Paper of Session Award at the 51st International Symposium on Microelectronics, Pasadena, CA, U.S.A., October 2018
  2. 2016 IEEE CPMT Best Journal Paper Award in the category, “Electrical Performance of Integrated Systems”
  3. 2016 John A. Wagnon Technical Achievement Award from the International Microelectronics Assembly and Packaging Society (IMAPS), for his outstanding technical contributions to the microelectronics industry worldwide
  4. Fellow of IMAPS for his numerous technical contributions and multiple leadership roles in the society. Award received in 2014
  5. 2012 Fraunhofer IZM Research Award for his work on the development and successful application of novel “methodologies, models and design measures for electromagnetic optimization of high-frequency and high-speed systems”
  6. Best Paper of Session Award at the 43rd International Symposium on Microelectronics, Raleigh, NC, U.S.A., November 2010
  7. Best Paper of Session Award at the 42nd International Symposium on Microelectronics, San Jose, CA, U.S.A., November 2009
  8. Tiburtius-Preis 2007, awarded by the Rectors and Presidents of all Universities in Berlin (Landeskonferenz der Rektoren und Presidenten der Berliner Hochschulen (LKRP)) for second best doctoral dissertation of all doctoral dissertations in all subjects in all universities in the state of Berlin, Germany, in 2006.
  9. Best Paper of Session Award at the 40th International Symposium on Microelectronics, San Jose, CA, U.S.A., November 2007.
  10. Silver Leaf Certificate Award at the IEEE Conference on Ph.D. Research in Microelectronics and Electronics (PRIME 2006), Otranto (Lecce), Italy, June 2006
  11. Best Poster Paper Award at the 55th IEEE Electronic Components and Technology Conference (ECTC 2005), Lake Buena Vista, FL, U.S.A. (Award presented one year later at ECTC 2006 in San Jose, CA)
  12. Best Paper of Session Award at the 36th International Symposium on Microelectronics in Boston, MA, U.S.A., November 2003