Rolf Aschenbrenner received the B.S. degree in mechanical engineering from the University for Applied Science, Gießen, Germany in 1986 and the M.S. degree in physics from The University of Gießen, Germany, in 1991. Since March 1994 he has been employed at the Fraunhofer Institute for Reliability and Microintegration (IZM), where he is presently the Deputy Director and Head of the Business Development Team.
Karl-Friedrich Becker studied materials science at Technical University of Berlin with a focus on polymer physics; he finished his studies in 1995 with a degree Dipl.-Ing. Materials Science.
In 1996, he joined Fraunhofer IZM, since 2001, he is heading the group Assembly & Encapsulation in the department System Integration and Interconnect Technologies. Recent research is focused on Heterogeneous Integration, Chiplet Packaging and Process Digitalization. Results of his research on advanced packaging have been presented at multiple international conferences.
Carsten Brockmann studied Computer Engineering at the Technical University of Berlin (TUB) and graduated as an engineer in 2008. He then worked as a research associate at the TUB's research center Technologies of Microperipherics in the field of wireless sensor systems until he moved to the Fraunhofer Institute for Reliability and Microintegration (IZM) in 2014, where he continued his research activities within numerous projects in the field of embedded systems and became group leader of the "Sensor Nodes and Embedded Microsystems" group in 2015.
Managing Director of Fraunhofer IZM since 2024, Ulrike Ganesh studied electrical engineering at TU Berlin and earned her PhD summa cum laude in 2008. She gained international research and industry experience at IBM, Qualcomm, and Bosch, later leading the Non-destructive Testing department at the Federal Institute for Materials Research and Testing (BAM). She is a renowned expert in semiconductor characterization and failure analysis and has extensive know-how in chip development and complex R&D projects, with focus areas including quantum computing, 6G, bioelectronics, and hardware security.
Dr. Alexander Gäbler is group manager on high frequency and high-speed system design at Fraunhofer IZM Cottbus. After graduating from Brandenburgische Universität Cottbus-Senftenberg in electrical engineering and computer science he completed a Ph.D. on the synthesis of controllable high-frequency circuits and analysis of liquid crystal transmission line phase shifters in antenna arrays for satellite applications in Ka-band. After working at Computer Simulation Technology (CST) and Alcan Systems GmbH he joined Fraunhofer IZM in 2023.
Vasiliki (Vasso) Giagka is an Associate Professor of Bioelectronics at TU Delft and Research Group Leader at Fraunhofer IZM in Berlin. She leads interdisciplinary research at the intersection of engineering, materials science, and neuroscience, focusing on soft, multimodal neural interfaces that integrate electronic, optical, and acoustic modalities to enable precise sensing and modulation of neural activity. Her work aims to advance implantable technologies for long-term, reliable interfacing with the nervous system across spatial and temporal scales.
Prof Hoene joined Fraunhofer Institute for Reliability and Microintegration as scientific assistant and worked in parallel towards his Ph.D., which was given in 2001 by the TU Berlin. He Continued as Postdoc and group leader. In 2014 he became adjunct Professor at Aalborg University, in addition to the courses he chairs for the European Center for Power Electronics. Now he acts as Chief Expert Power Electronics at IZM. His focus is on power modules, fast switching, power electronic developments like On board chargers, motor drives and AI power supplies.
Ole Hölck studied physics at the Institute of Materials Physics of the University in Göttingen. He worked as a research scientist at the Federal Institute for Materials Research and Testing, Berlin, and received his Ph.D. from the TU Berlin in 2008 on the topic of small molecule diffusion in polymers using experimental and numerical methods. He joined Fraunhofer IZM in 2008 and focused on the topics of thermomechanical materials properties and reliability for microelectronics. Since 2017 he is responsible for the material analytics lab and the panel level compression mold process.
Dr.-Ing. Johannes Jaeschke has led the "System Reliability Assessment" group at Fraunhofer IZM since 2015. Following his degree in electrical engineering, he completed a PhD in 2012 on electromigration in solder Joints. His research focuses on reliability management of electronic systems and their condition assessment through digital twins to support a sustainable circular economy. He supervises student theses at Fraunhofer IZM and TU Berlin, where he also teaches methods for reliability assessment of integrated electronic systems.
Erik Jung studied physics and physical chemistry at the University Kaiserslautern. He joined Fraunhofer IZM in 1994 as research scientist. Staying with Fraunhofer, Erik was instrumental in the development of key technologies like embedded IC, MEMS packaging and wearable systems. After a delegation to the University of Utah, he headed the Medical Device Integration Program at IZM and was appointed to business development in 2015. Erik is an IEEE and DGBMT member, founding member of IVAM´s wearable electronics initiative and holds a position on the board of Organic Electronic Saxony since 2018.
Manuela Junghähnel received 2011 her Doctor of Engineering in the Dept. of Mechanical Engineering of TU Ilmenau. Since 2022 she is heading the Center All Silicon System Integration Dresden - ASSID, a department of Fraunhofer IZM, which operates a state-of-the-art 300 mm process line for 2.5 and 3D wafer level system integration. Her working field is focused on leading edge advanced packaging and 3D heterogeneous integration. Beside the activities at IZM-ASSID, Manuela is heading together with Dr. Wenke Weinreich from IPMS-CNT the Center for Advanced CMOS & Heterointegration Saxony.
Ruben Kahle has been with the Fraunhofer IZM since 2008. After completing his training as a microtechnologist, he earned a Bachelor’s degree in Mechanical Engineering and a Master’s degree in Industrial Engineering while working. He then spent five years as a researcher in the Embedding and Substrates group, where he gained extensive experience in the development and integration of innovative packaging and interconnection technologies. Since 2025, he has been leading the Embedding and Substrates group, overseeing its strategic and technical advancement.
Ivan Ndip is a full Professor at the Brandenburg University of Technology (BTU) in Germany. He is also with Fraunhofer IZM (since 2000) where he leads the Department of RF & Smart Sensor Systems in Berlin and the IZM Branch Lab for High-Frequency Sensors & High-Speed Systems in Cottbus. He studied electrical engineering and obtained his Dipl.-Ing. (M.Sc.) and Dr.-Ing. (Ph.D.) degrees from Technische Universitaet Berlin. He received a second doctorate degree, Dr.-Ing. habil., also in electrical engineering from BTU Cottbus-Senftenberg. Prof. Ndip is a Fellow of IMAPS and Senior Member of IEEE.
I am head of the Environmental and Reliability Engineering Department, responsible for personnel, finances, strategic planning, and project oversight for both staff and students. I have managed key projects, including the EU Preparatory Studies on Networked Standby and Off-mode energy losses, as well as initiatives on eco-assessments, renewable materials in electronics, and legal compliance with WEEE, RoHS, and EuP/ErP. I also lecture on "Electronics and Environment" at TU Berlin and have served as Technical Chair of the Electronics Goes Green conferences and Conference Chair of PLATE 2019.
Hermann Oppermann received the Doctor degree in Materials Science at the Metals Research Institute of TU Berlin. Since 1993 he has been with the Microperipheric Center of TU Berlin, and was working in flip chip and CSP packaging.
1999 he moved to the Fraunhofer IZM and leads the group „Fine Pitch Assembly and Interconnects“. He contributed to the field of flip chip, die attach and wafer level packaging for MEMS, RF, opto and power applications. He was driving the development in AuSn soldering in die bond and flip chip applications, transient liquid phase bonding and nanoporous gold bonding.
Dr. Michael Schiffer received his diploma in electrical engineering in 2003, and his doctorate degree in 2010, both at the Technical University in Berlin. In 2009, he joined TDK Sensors, where he later headed the process development and operations department. In 2018 he joined Fraunhofer IZM and since 2019 he’s been the head of the department "wafer level system integration” with around 50 permanent employees. His particular interests are innovative 2.5D/3D system integration technologies for heterogeneous chiplet integration, e.g. Si-/glass interposer, bridge embedding or Fan-Out WLP.
Julian Schwietering received his M.Sc. in Technical Physics from the Technical University of Ilmenau, Germany. Since then, he worked at Fraunhofer IZM as a researcher specializing in glass-based electro-optical circuit boards (EOCBs). His research centers on integrating optical waveguides into glass. He now leads the Optical Interconnection Technology group, which develops EOCBs and other innovative glass-based photonic packaging solutions.
Dr. Lutz Stobbe is a senior scientist and group leader at the Fraunhofer Institute for Reliability and Microintegration (IZM) with 25 years of professional experience in the field of green information and communication technology (Green ICT). The research of his "Sustainable Networks and Computing" group focuses on methodological issues of life cycle assessment (LCA) and applied ecodesign, particularly for computing and networking equipment in data centers and telecommunication. He developed the 6C methodology, which supports structured modeling of complex life cycle inventory models(LCI) for ICT systems.
Tolga Tekin received his Ph.D. in EECS from TU Berlin in 2004. He has conducted research at Fraunhofer HHI, UC Davis, Teles AG, and TU Berlin on PICs, phased-array antennas, and packaging. He leads the Photonic & Plasmonic Systems Group at Fraunhofer IZM. His R&D focuses on heterogeneous systems, interconnects, and optical/wireless networks. He coordinated EU projects PhoxTroT, L3MATRIX, MASSTART, and leads ALLEGRO — a Horizon Europe flagship initiative for agile, ultra-low-energy, secure optical networks. His work contributes to driving innovations for next-generation systems and networks.
Christian Bernd Tschoban received the M.Sc. (Dipl.-Ing.) and Ph.D. (Dr.-Ing.) degrees in electrical engineering from the Dresden University of Technology, Dresden, Germany, and the Technical University of Berlin (TU Berlin), Berlin, Germany, in 2010 and 2021, respectively. Since 2010, he has been a Research Engineer with the radio frequency (RF) and High-Speed System Design Group, Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin. He has headed the Radar Frontends and Modules working group since 2015.
Tina Thomas studied Mechanical Engineering at the Technical University of Berlin, specializing in Micro System Technologies. She joined Fraunhofer IZM during her studies and has worked as a scientific engineer in the System Integration and Interconnect Technologies department since 2006. Her field of research is now the encapsulation of microelectronics, the qualification of processes using both destructive and non-destructive tools, and the analysis of polymer encapsulants using a wide variety of methods. Her recent research focuses on the encapsulation of smart power modules.
Dr. Stefan Wagner received his Dipl.-Ing. degree in electrical engineering from the Technical University of Berlin in 1998. In 2009, he received his Ph.D. from the same university with a dissertation on “Development of micro-polymer membrane fuel cells using microstructuring technologies.” Since 2000, he has been working at the Fraunhofer Institute for Reliability and Microintegration (Fraunhofer IZM). Starting in 2015, he led a group within the Department of Environmental and Reliability Engineering that focuses on issues related to the reliability of electronic assemblies and systems as well.
Dr. Frank Windrich graduated 2003 in Chemical Engineering, received a master degree in chemistry in 2013 and a doctoral degree in polymer chemistry in 2018. After 7 years working as process engineer in the PCB industry he joined Fraunhofer IZM in 2010 working on advanced wafer-level packaging and 3D-integration technologies. Since 2018 he is leading the group “Lithography and Polymers for Wafer-Level Packaging” at Fraunhofer IZM-ASSID. He is currently the deputy head of Fraunhofer IZM-ASSID working in the field of 2.5D/3D chiplet and wafer-scale integration technologies.
Markus Woehrmann (born 1984) earned his M.Sc. in Electrical Engineering from the Technical University of Berlin in 2010. Since then, he has focused on the estimation of electrical and mechanical properties of thin film layers at the same institution. In 2016, he joined the Fraunhofer Institute for Reliability and Microintegration (IZM), where he has been leading the "Lithography and Thin Film Polymers for Wafer-Level Packaging" group since 2019. In this role, he is responsible for the process development of RDL processing for Fan-In, Fan-Out Wafer and silicon/glass interposers.
Fraunhofer Institute for Reliability and Microintegration IZM