Conference & Exhibition  /  September 11, 2023  -  September 14, 2023

EMPC - European Microelectronics and Packaging Conference & Exhibition

The 24th European Microelectronics & Packaging Conference (EMPC) is a prestigious event that focuses on the latest developments in electronic packaging technology. This year's conference will take place from September 11th to 14th, 2023, near Cambridge.

Fraunhofer IZM will not only be represented as an exhibitor but will also conduct a series of presentations to share its research findings in the field of electronic packaging.

Our IZM-colleagues Tanja Braun and Markus Wöhrmann are offering a Short Course on “From Wafer to Panel Level Packaging" on Monday, September 11, 2023.

Another presentation will be given by our expert Lars Böttcher on the topic "Concepts for Realizing High-Voltage Power Modules by Embedding of SiC Semiconductors" on Tuesday, September 12, 2023 from 9:45 - 10:45 am in Session 1 "Embedding".