Conference & Exhibition  /  September 13, 2021  -  September 16, 2021

EMPC - European Microelectronics and Packaging Conference & Exhibition

The 23rd European Microelectronics and Packaging Conference & Exhibition 2021 (EMPC) is set to take place online this year from 13-16 September. The conference will present the best of microelectronics packaging and interconnection technologies, covering technological innovation in this field with contributions from both industry and academia. Next to a range of interesting keynotes and technical sessions, participants can also register for a professional short course. In this context Fraunhofer IZM’s Tanja Braun and Michael Töpper will offer a course on “Implications of New Semiconductor-Trends for IC-Packages” on September 13, from 11:30 am – 2:30 pm (CET).