Conference & Exhibition  /  September 14, 2027  -  September 16, 2027

EMPC 2027

The European Microelectronics & Packaging Conference (EMPC) is a prestigious event that focuses on the latest developments in electronic packaging technology. This year's conference will take place from September 14th to 16th, 2027, in Ingoldstadt.

Fraunhofer IZM will not only be represented as an exhibitor but will also conduct a series of presentations to share its research findings in the field of electronic packaging.