Workshop  /  September 06, 2023  -  September 07, 2023

Fraunhofer IZM exhibits at EuroPAT Workshop 2023

The European Packaging, Assembly, and Test – Workshop 2023 (EuroPAT-WS) aims to promote mutual cooperation and strengthen the semiconductor packaging ecosystem in Europe. The conference brings together experts from all areas of the semiconductor supply chain and offers the opportunity for exchange and networking. The event will take place in Nijmegen, the Netherlands, from 6 to 7 September 2023.

Fraunhofer IZM will be exhibiting and presenting its research in the field of microelectronic packaging.