Conference  /  October 11, 2021

What does 6G mean for packaging?

Fraunhofer IZM at IMAPS 2021

The 54th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The Symposium will feature 5 technical tracks, plus our Interactive Poster Session, that span the three days of sessions with emphasis on packaging technologies that serve 5G, high performance computations, automotive, industrial, defense/space, and medical electronics markets. On the first day of the workshop


Workshop - What does 6G mean for packaging?

One terabit per second at a latency of around 100 microseconds – the goals for 6G applications like industry 4.0, medical technology, driverless cars, and smart cities are quite ambitious.

But first we are facing major packaging challenges!

Advanced system integration technologies, novel integrated terahertz MIMO antenna arrays, and novel high frequency design methods for constructing 6G frontend modules need to be developed.

Currently, Fraunhofer IZM is working on a concept that will form the basis for a powerful, miniaturized broadband D-band module. To turn these designs into actual hard-ware, the institute is employing its patented fan-out wafer-level packaging system integration platform with integrated antennas that have not even been built yet. Compared to existing package platforms, this enables excellent high frequency performance and makes the system smaller, more reliable, and more economical.

This workshop is part of this year's IMAPS 2021, 54th International Symposium on Microelectronics. All participants of IMAPS 2021 will receive a TEAMS Meeting link if they wish to attend this Virtual Workshop on Monday, October 11 from 12:00pm-2:15pm PACIFIC. 

This meeting will be recorded and all registered attendees for the Symposium will receive a recording link for on-demand replay. 

The workshop is free of charge