Messe München / June 24, 2019 - June 27, 2019
LASER World of PHOTONICS 2019
http://world-of-photonics.com/
Fraunhofer joint booth: B3-335
http://world-of-photonics.com/
Fraunhofer joint booth: B3-335
From June 24-27 the LASER World of PHOTONICS, the world’s leading trade fair with congress for photonics components, systems and applications, will be taking place at Messe München. More visitors 32.000 visitors are expected this year.
Fraunhofer IZM will be presenting innovations from the field of photonic packaging in Hall B3, booth 335. We look forward to seeing you there!
The focus of the presentation will be on:
About the event:
This event is the only place that depicts the entire value chain for photonics and features a unique combination of research, innovative technology and industrial application sectors. Visitors not only have the opportunity of informing themselves about the key players in the photonics industry at the booths of 1.300 exhibitors from all over the world, but they can also deepen their knowledge and network in educational forums, panels and roundtable discussions.
Within the project HyPOT, Fraunhofer IZM has developed a hybrid integrated glass-silicon based interposer for data communication at a wavelength of 850 nm.
A glass interposer with through glass vias (TGVs) is used as a carrier for flip-chip mounted VCSEL, PD and driver ICs. The interposer processing at wafer level using state-of-the-art technology allows a high density redistribution layer and high aspect ratios for TGVs. The RF routing on the glass interposer is optimized for data rates up to 28Gbit/s/channel. The optical path crosses the transparent substrate material with individual Fresnel or polymer lenses applied.
Advantageously for cooling is the bottom emitted optical signal and the flip-chip approach which allow an improved cooling of the components from the top. This approach excels cooling possibilities of commercial products. The optical design reduces losses down to <0.5 dB for RX or <2 dB for TX.
The multi-emitter module project has achieved the efficient coupling of a four-emitter laser chip at a wavelength of 1470 nm to an optical fiber with a 70 µm core, suitable for medical uses. Fraunhofer IZM performed the high-precision mounting of the micro-optical bank consisting of laser-produced glass components on a footprint of 6.5 mm by 25 mm. Four microoptical elements (FAC, beam twister, SAC, and fiber coupling lenses) were mounted with active alignment at full optical laser output of 10 W. To achieve this, special alignment and joining processes were developed for an industrial pick & placer for optical components to achieve precision alignment with six degrees of freedom in accuracies of better than 200 nm and two arcsec, respectively.
The AutoFly project has produced an automatically packaged 808 nm laser module. The package can be hermetically sealed for application in harsh conditions. The high-precision mounting of a double-sided single lens with an innovative optical pick&placer was fully automated, with active alignment used to achieve a highly collimated and aligned free beam. This makes the system particularly suitable for sensor and interferometer applications.
Modern medicine treats venous disorders with laser therapy. A fibre optic system is carefully inserted into the affected veins and uses a laser to ablate the damaged tissue. The Fraunhofer IZM has developed a novel process that uses a laser to produce the cone-shaped fibre optic tips for the system with unrivalled precision. With typical diameters of only 0.6 mm, the system can now be used to treat even tiny capillary veins.
In contribution to the international HDP consortium, Fraunhofer IZM is providing gradient index multi-mode glass waveguide for optical backplanes. The glass waveguides, which are manufactured by a thermal ion-exchange process are optimized for wavelengths of 1310 nm and 1550 nm but can also be used for 850 nm with slightly higher propagation losses. At their design wavelength, they are optimized to match standard 50 µm GI-MMF fiber launch conditions incorporating an attenuation loss lower than 0.05 dB/cm. Connectorization of the board is done by MT ferrule mounts provided by Seagate. The board is part of a comparison of all major electro-optical circuit board technologies.
As part of the PhoxTroT consortium, Fraunhofer is contributing gradient index single-mode glass waveguides, which are made on wafer level. Similar to silicon photonics waveguides these waveguides are created by using standard wafer-level processes only. Additionally, a thermal ion-exchange process providing an adequately matching coupling condition and propagation losses down to 0.1 dB/cm at the design wavelength of 1550 nm was used. Wafer level waveguide processing was followed by standard wafer level RDL processes needed for interposer connection and electrical contacts.
Chip package with optical interconnections, spectral operation from 400nm to 1000nm from EU-project InSPECT with partners Lionix (chip manufacturing), Aifotec (fiber array assembly), and others.
Telecom receiver realized in SiGe-BiCMOS, coupling via grating couplers for 400Gbps coherent data transmission from BMBF-project SPeeD with partners ADVA, IHP, and others.