From June 24-27 the LASER World of PHOTONICS, the world’s leading trade fair with congress for photonics components, systems and applications, will be taking place at Messe München. More visitors 32.000 visitors are expected this year.

Fraunhofer IZM will be presenting innovations from the field of photonic packaging in Hall B3, booth 335. We look forward to seeing you there!

The focus of the presentation will be on:

  • Thin glass-based electrical-optical-circuit-board (EOCB) and optical subassemblies for high bandwidth applications
  • 3D integration, sub-micron automated assembly, and reliable packaging
  • Photonic integration platforms (optical substrates, components and interconnects)
  • High bandwidth optical fiber based modules
  • Photonic design for packaging
  • Low cost approaches for high volume applications

About the event:
This event is the only place that depicts the entire value chain for photonics and features a unique combination of research, innovative technology and industrial application sectors. Visitors not only have the opportunity of informing themselves about the key players in the photonics industry at the booths of 1.300 exhibitors from all over the world, but they can also deepen their knowledge and network in educational forums, panels and roundtable discussions.

 

 

Our Highlights: