Symposium  /  01/30/2019

Panel Level Packaging Symposium

Status update at SEMI’s 3D & Systems Summit

It is our great pleasure to invite you to the next Symposium on »Status & Trends in Panel Level Packaging« at Hilton Hotel in Dresden as post event of the 3D & Systems Summit.

Join the symposium to receive latest research results on this exciting new manufacturing technology enabling:

  • Market and application trends
  • Latest technology results for PLP
  • Material, equipment and process developments for large area and fine line processing
  • Cost analysis