Seminar / September 28, 2021 - September 29, 2021
SEMI Packaging Technology Seminar
On September 28-29, 2021, the SEMI Packaging Technology Seminar will take place in Hof (Upper Franconia). Here, experts from the fields of semiconductor packaging, assembly, test manufacturing and design will meet to discuss the challenges facing the semiconductor industry, such as disruptions in the supply chain, and to find solutions.
Fraunhofer IZM will be presenting recent research developments at the concurrent exhibition and on September 28 at 5:00 pm IZM-groupleader Tanja Braun will share her insights on "Fan-Out WL/PL Packaging - a European Perspective for Advanced Packaging".