Workshop / 06/12/2018 - 06/13/2018
Photonic Packaging: Sub-micron Assembly
Photonic integration in data communication is driven today both by the increasing demand for bandwidth and higher channel density within the systems. Furthermore miniaturization in lightening and projection techniques, and a wide variety of optical sensors require new photonic assembly concepts to reduce cost and guarantee reliability. Photonic integrated circuits (PIC) and MOEMS based devices need 3D-integration, and challenges in terms of optical fibre attachment have to be solved. Photonic packaging is crucial and includes single packages, modules or subsystems comprising at least one optoelectronic device or micro-optical element and optical interconnects.
High precision alignment is a key, yet the lack of standards for photonic interconnects hinders low cost generic solutions. We see that there are many challenges to be taken by OEM manufacturers, suppliers and service assemblers to face the specific challenges regarding very tight tolerances. Sub-micron accuracy has to be achieved and maintained during operation for many photonic applications.
Thus the Photonics Packaging Workshop 2018 at Fraunhofer IZM focuses on sub-micron assembly technologies for optoelectronic and photonic integration on board, package and device level.
Who should attend: The workshop addresses scientists and engineers involved in photonic packaging: Process technology, materials and equipment, as well as decision makers.