Fraunhofer IZM ASSID showcases recent research results at European 3D TSV Summit

Grenoble (France) /

After last year's successful debut, the European 3D TSV Summit, organized by SEMI Europe, took place for the second time from January 22-23, 2014 in Grenoble. The theme of this year’s event was “Application Ready,” addressing 3D TSV from both a business and technology perspective.

Fraunhofer IZM's ASSID Center ("All Silicon System Integration Dresden") was co-organizer of the European 3D TSV Summit and presented its latest research results both at the conference and at the concurrent exhibition.

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