Workshop: Customized packaging for electronics and sensor technology

Berlin, /

On May 26th, 2011 approximately 40 participants caught up on the current trends in component integration at Fraunhofer IZM’s workshop on “Customized packaging for electronics and sensor technology”.

After a theory-based introduction, the visitors put their new knowledge into practice in the institute’s laboratories by testing component reliability, trying out different approaches in quality assurance and studying material- and stress-based failure mechanisms.

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