Lars Stagun wins the Best Presentation Award at the IMAPS fall conference
Every year, the microelectronics association IMAPS Germany hosts its annual conference in new developments in packaging and interconnects technology. At this year’s conference on 20 and 21 October 2022 in Munich, Lars Stagun, research assistant at the Technical University of Berlin, was honored with the Best Presentation Award.
Stagun received the award for his contribution on “Adhesive Bonding – Reliable Integration of Electronics Modules in Textiles” that investigated the means to integrate electronics in textile objects. For the evolution of smart textiles, a way has to be found to achieve the robust integration of electronics in textile substrates. In his paper, Stagun explored the adhesive bonding technology that works without soldering or crimping for the mechanical and electrical integration of modules in fabrics in a single step. To copy the approach from conventional electronics production to the special conditions of textiles, Fraunhofer IZM and the Key Research Area Microperipheral Technologies at the Technical University of Berlin developed a textile bonder that combines processing parameters that work on textile fabrics with the precision required in electronic interconnections.
The fall conference of IMAPS Germany is considered the key platform for the professional dialogue between industry and academia and for the people in research and manufacturing that work to strengthen Germany’s economic footprint in the field. At this year’s conference, around 90 delegates were on site to listen to 21 talks and meet and speak to twelve exhibitors.