The annual ESTC gives representatives from science and industry a forum for presenting their work to an interested expert audience. This year, the IZM came to Dresden to showcase its exhibits in the fields of integration technologies, wafer level packaging, testing and analytics, and reliability.

The greatest attraction among more than ten exhibits at the IZM booth was its 18x24” demo panel. With its research into fan-out packaging, the IZM has committed itself to a promising new trend in microelectronics that offers great potential for miniaturization. The Institute was also actively represented on this year’s conference agenda in the person of Dr. Tanja Braun. In her tutorial on “Fan-out panels: Is the industry ready?”, the attendees discussed the different perspectives concerning this very topical question. The audience also had a chance to get involved and seize the opportunity to speak to partners and colleagues in the field.

Website ESTC 2018: https://www.estc-conference.net/home/