DESIGN & ELEKTRONIK

Fraunhofer IZM named "Innovator of the Year"

25.10.2018

The integration of microchannels into the silicon interposer allows for the first time to cool a processor also from the bottom and thereby increase the computing power.
© Fraunhofer IZM | Volker Mai

The integration of microchannels into the silicon interposer allows for the first time to cool a processor also from the bottom and thereby increase the computing power.

The readers of DESIGN & ELEKTRONIK have named Fraunhofer IZM "Innovator of the Year"

In the competition, which aims to make the "stars behind the products" visible, the development of a chip cooling system by Fraunhofer IZM as part of the EU CarriCool project was recognized in the category "Chip Production". The award was presented to M. Jürgen Wolf and Dr. Hermann Oppermann in Munich on October 25 

Dipl.-Ing. M. Jürgen Wolf | Head of Department, Management ASSID
© Fraunhofer IZM | ASSID

Dipl.-Ing. M. Jürgen Wolf | Head of Department, Management ASSID

Dr. Hermann Oppermann | Department WLSI
© MIKA-fotografie | Berlin

Dr. Hermann Oppermann | Department WLSI