Fraunhofer IZM at the #3DSUMMIT 2020
Anybody who is – or wants to become - anybody in the 3D integration scene had to be in Dresden from 27 to 29 January 2020 for this year’s 3D & Systems Summit.
Fraunhofer IZM joined the event to showcase its expertise in several sessions and contributions. M. Jürgen Wolf, Department Head at Fraunhofer IZM ASSID in Dresden, hosted a special session on heterogeneous integration, while his colleague Uwe Maaß from the Berlin-based R3S unit introduced his audience to new packaging platforms for the heterogeneous integration of 5G mm Wave components. Fraunhofer IZM also teamed up with its fellow Fraunhofer Institute ENAS and the High Performance Center “Functional Integration of Micro and Nanoelectronics” to present the newest wafer-level layouts and recent trends in through-silicon vias, 3D-Packaging, heterogeneous system integration, and System-in-Package technologies at their shared exhibit.
This year’s Summit was another great success for the exhibitors: More than 200 attendees from 14 countries had an opportunity to meet and hear from numerous experts, catch up on the current offerings and special highlights of the exhibiting companies and last, but not least, get in touch with other packaging experts from around the world. The event was a particularly meaningful occasion for the organizer SEMI Europe, as 2020 marks the 50th anniversary of the industry association.