New configurations of planar and 3D integrated antennas will be developed. The impact of fabrication technologies and their process variations on the impedance and radiation characteristics of these antennas will be systematically studied. Furthermore, novel system-integration platforms, which enable a higher integration density of high-frequency chips, antennas and passive components will be developed. The platforms will be modelled, characterized and optimized with respect to signal integrity, power integrity and electromagnetic compatibility. Finally, miniaturized sensor systems will be designed, fabricated and tested. The branch lab will also focus on novel concepts for improved hardware security (Trusted Electronics). The fabrication and assembly of the sensor components, modules and systems will done in the departments of System Integration & Interconnection Technologies, and Wafer Level System Integration at Fraunhofer IZM.

The branch lab collaborates with the Brandenburg University of Technology (BTU) Cottbus-Senftenberg, with IHP (Innovations for High Performance Microelectronics) Frankfurt/Oder, Ferdinand-Braun Institute für Höchstfrequenztechnik (FBH) Berlin and the Fraunhofer Institute for Photonic Microsystems Dresden within the Framework of Innovationscampus (iCampus) Cottbus.