Last June, the final edition of SMTconnect took place. Since then, the "Future Packaging" production line has continued to evolve and is now taking off in a new setting.

What began in the late 1990s has grown continuously, most recently bringing together 19 line-participants and co-exhibitors in an area spanning 1,200 m². The 52-meter-long "Future Packaging" line demonstrated how machines from various manufacturers work together seamlessly in electronics production to assemble circuit boards. The line attracted numerous trade visitors and became one of the trade fair's biggest attractions. At its last edition, the “Future Packaging” stand attracted an impressive 2,700 visitors over the three days of the trade fair. However, "Future Packaging" was more than just a technical exhibition; it represented innovation and collaboration in electronics production. Thanks to its continuous development and presentation of cutting-edge production technologies, it became an indispensable highlight of the trade fair. SMTconnect may be over, but the Future Packaging concept lives on. A further development is planned for Productronica in Munich.