Herbert Reichl receives one of the IEEE’s highest awards IEEE Components, Packaging & Manufacturing Technology Award 2010
From tiny electronic modules for mobile phones and laptops to highly reliable radar sensors – Herbert Reichl has helped shape the development of countless microelectronic applications. In recognition of his achievements, the „Institute of Electrical and Electronics Engineers (IEEE)“, which is the largest professional association in the world and is active globally, has named Professor Reichl as recipient of their „Components, Packaging & Manufacturing Technology Award 2010“IEEE Components, Packaging & Manufacturing Technology Award 2010“.
The international acknowledgement honors Herbert Reichl’s important contribution to microelectronics and microsystem technology, which have seen Germany become a world leader in the integration of electronics in the products of tomorrow.
This special acknowledgement is above all also the culmination of Herbert Reichl’s ceaseless efforts, which is borne out by his career path. Born in Munich, Professor Reichl completed his doctorate at the Institute for Integrated Circuits at the TU Munich in 1974 and went on to head the Department of Semiconductor Technology and Sensors at Fraunhofer IFT until 1986. In 1981, he is appointed Professor at the regional technical college.
Professor Reichl was one of the first to recognize the importance of packaging for microelectronics and, after publishing a series of respected studies about modern packaging technology and sensor technology concepts, he accepted an appointment to the TU Berlin in 1987. While his initial role was as Head of Forschungsschwerpunkts Technologien der Mikroperipherik, he has also been Director of the Fraunhofer Institute for Reliability and Microintegration IZM since 1993. This allowed him to combine first-rate basic research with applied research for industry. His output to date includes 60 registered patents, over 950 scientific publications and countless reference books.
The IEEE is the world’s largest professional association in the technology sector and was established more than 40 years ago. Its annual Components, Packaging & Manufacturing Technology Award recognizes special achievements in the research area.