Award

John A. Wagnon Technical Achievement Award for Ivan Ndip

Pasadena, California, USA / October 20, 2016

IZM Researcher Ivan Ndip receives the 2016 John A. Wagnon Technical Achievement Award
© MIKA-fotografie | Berlin

The International Microelectronics Assembly and Packaging Society (IMAPS) awards the John A. Wagnon Technical Achievement Award once every year to an individual that has made outstanding technical contributions to the microelectronics industry worldwide.

The 2016 John A. Wagnon Technical Achievement Award was awarded to Dr. Ivan Ndip for his outstanding technical contributions in the field of electromagnetic modeling, RF design and optimization of microelectronic components, modules and systems, especially for communication and radar sensor applications.

This prestigious award was handed over to Dr. Ndip by IMAPS President, Susan Trulli, on the 11th of October 2016 during the award presentation ceremony at the 49th International Symposium on Microelectronics in Pasadena, California, USA.

IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies worldwide.

Dr. Ndip leads the department of RF & Smart Sensor Systems at Fraunhofer IZM.

He has authored and co-authored more than 150 scientific publications in referred journals and conference proceedings. He is a recipient of numerous best paper awards at leading international conferences, and the Tiburtius-Prize (Preis der Berliner Hochschulen), awarded yearly for outstanding Ph.D. dissertations in the state of Berlin, Germany. He is also the recipient of the 2012 Frauhofer IZM Research Award for the development and successful application of novel methodologies, models and design measures (M3-approach) for electromagnetic optimization of high-frequency and high-speed systems.

Dr. Ndip has taught professional development courses (PDCs) in the area of RF and high-speed system design to hundreds of practicing engineers worldwide. He also teaches graduate courses in the faculty of Electrical Engineering and Computer Science at the Technische Univeristät Berlin.

He and his team at IZM currently work on the development of autonomous ultra-low-power wireless sensor nodes and systems as well as on the development of reconfigurable and smart RF systems for emerging wireless communication and radar sensor applications.

Dr. Ndip is a Fellow, and Life Member of IMAPS, as well as a Senior Member of IEEE.