On December 21 the Fraunhofer-Institute for Reliability and Microintegration IZM presented the Research Award for outstanding achievements in the realm of packaging and interconnection technology fort he sixth time in a row.

The winner this year is Christine Kallmayer, who was honored for her work on flip chip assembly on flexible substrates. Ms. Kallmayer received her award from Fraunhofer IZM’s director, Professor Herbert Reichl, during a ceremony in Berlin on December 21, 2005.

Christine Kallmayer started working at Fraunhofer IZM in 1994 and has since established an international reputation as the group manager responsible for System Integration on Flex. Two years ago Kallmayer’s team developed new interconnection technologies for the integration of flexible circuits into textiles. These were successfully applied in a bicycle courier’s outfit, a development that generated lively interest both from the scientific community and the public. One of Kallmayer’s most outstanding characteristics is her versatility. She is also a specialist for the assembly of ultrathin chips, conductive adhesives and the printing of polymer pastes.