The Director of Fraunhofer IZM turns 65

Happy Birthday, Klaus-Dieter Lang! / 8.12.2019

Professor Klaus-Dieter Lang, Director of Fraunhofer IZM since 2010 and professor at the Technical University of Berlin’s chair of “Nano Interconnect Technologies” since 2011, is celebrating his 65th birthday on 8 December 2019. The internationally renowned expert for system integration technologies in microelectronics has masterminded the Institute’s transition from a primarily technological focus to more complex applications for microelectronic systems.

Fraunhofer IZM | Janine Escher - Prof. Dr.-Ing. Dr. sc. techn. Klaus-Dieter Lang
© Fraunhofer IZM | Janine Escher

His success rests on his unique combination of creative scientific thinking with the efficient management of innovations. His work contributed substantially to Fraunhofer IZM being named by Germany’s Science Council as the country’s prime research organization for electrical engineering in recognition of the Institute’s scientific excellence. The operating budget of the Institute has grown by no fewer than 45 percent under his leadership (2010: €23.1 million, 2018: €33.7 million), with revenue from direct industry partnerships more than doubling since he took office (2010: €7.5 million, 2018: €15.3 million). Over the same period, the Institute has welcomed 103 additional members of staff (a plus of 32.9 percent).

In 2014, Professor Lang was awarded the Fraunhofer Medal in recognition of his exceptional contributions to science and research, followed three years later by the international research association IMAPS’  William D. Ashman Achievement Award for electronic packaging and system integration. He was nominated as an IEEE Fellow in the field of heterointegration and microelectronics packaging in 2018 and won the most prestigious award given out by the VDE association’s Microelectronics, Microsystem, and Precision Engineering Society – the GMM Award – in October 2019. Professor Lang is also a fellow and life member of IMAPS.

Professor Lang has authored and co-authored four monographs and is the prolific writer behind more than 370 publications on mounting and interconnection technology, packaging, microsystems engineering, and system integration.