The Qualification and Test Center (QPZ) is now providing failure analysis of components, boards and bonds via the internet.

The online service provides fast and straightforward support for identifying the causes of failure during assembly manufacturing or early in the field, as well as solutions for correcting them. In particular, our service covers:

• Assembly analysis according to IPC-A-610, class 1, 2 or 3
• Problems in soldering component connections
• PCB surface solderability
• Corrosion after field operation
  

We provide conclusive information about failures and their possible causes quickly and reliably. To communicate in real-time, conference software, a webcam and an internet-enabled microscope is used.

Equipment

We recommend the following equipment to ensure smooth access to our service:

• Broadband internet (upload: 500kbit/s or more) at the analysis site (WLAN or ethernet)
• High-performance PC or laptop (Core2Duo processor or comparable, high-performance graphics card)
• Webcam: Logitech 9000 pro (or comparable model),
• Internet-enabled microscope: dnt DigiMicro 1.3

QPZ services

We test the operating reliability of packages and solder alloys in their applicable assembly configurations under thermal, mechanical and/or climatic loading.

Our starting point is analyzing materials to determine the properties relevant for processing and operating reliability. These include the CTE and Tg of polymer circuit boards, as well as the layer thickness and solderability of substrates and component coatings.

Using special test boards, we perform accelerated reliability tests, the results of which can be used to derive the failure behavior of packages and materials. We analyze changes in solder joints, intermetallic phase growth and crack formation and propagation in test assemblies and assemblies that have already undergone field operation using failure and damage analyses.