The 10th IEEE Electronics System Integration Technology Conference (ESTC) took place from September 11 to 13, 2024, at the MOA Hotel in Berlin and was a resounding success. Led by Dr. Tanja Braun, department head at Fraunhofer IZM and general chair of the conference, the event significantly contributed to the exchange of information on the latest electronic system integration developments. With around 430 participants from 27 countries, the extensive program included four keynotes, 117 presentations, and 46 poster presentations. Topics included advanced packaging, wafer-level packaging, and the reliability of electronic devices and power electronics. A special highlight of the conference was the accompanying trade fair, where over 40 companies and research institutions from around the world presented their services. Many conference attendees took advantage of the breaks to learn about current trends, make new contacts, and reconnect with old acquaintances.