In 2024, Fraunhofer IZM organized the online expert series "Advanced Substrates beyond PCB," which dealt with innovative substrate technologies beyond conventional printed circuit boards. The four-part series aimed to provide in-depth insights into advanced solutions for next-generation electronics to experts from industry, science, and politics. The focus was on technologies that meet the increasing demands for miniaturization, performance, and sustainability.

Topics ranged from fan-out wafer and panel-level packaging as a platform for 2D and 2.5D system integration to the integration of III-V RFICs in antenna-in-package modules for 5G/6G applications to high-density organic substrates and glass core substrates. Taking place from late October to early December 2024, the series provided a valuable opportunity to exchange ideas on current developments and future trends in substrate technology. This contributed significantly to the further development of this key area of electronics.