The winner of the Young Engineer Award was announced on the last day of the 2011 SMT/Hybrid/Packaging trade show. Fraunhofer IZM Berlin’s Daniel Hahn carried the day with his poster, entitled “The Reliability of Concave Flip Chip Solder Joints under Combined Temperature and Vibration Loading”. The winner was decided in a popular vote by visitors to the trade show and Daniel took home a prize of 500 € as reward for his efforts.