Events

COMPAMED, the leading exhibition for medical technology manufacturers and developers, will again draw a crowd of technical buyers, R&D and manufacturing specialists, packaging, quality assurance, and qualification experts, and process engineers between 16 and 19 November.

Sustainable e-textiles, textile electronics, and new standards for connected textiles: At the E-Textiles Conference 2026, Fraunhofer IZM and TU Berlin will present the latest research findings and innovative technologies for the next generation of smart textiles.

From December 1 to 3, 2026, the international conference Going Green – CARE INNOVATION 2026 in Vienna will bring together leading experts from industry, academia, and politics to discuss the future of sustainable electronics. The focus will be on topics such as the circular economy, carbon footprinting, resource efficiency, digital product passports, and the environmental impacts of digital technologies. The conference is one of the most important international platforms for environmental and sustainability issues in the electronics industry.

Fraunhofer IZM, along with its division “All Silicon System Integration Dresden” (ASSID), will be represented at SEMICON Japan in Tokyo from December 9–11, 2026. In the German Pavilion, the research center will showcase innovative technologies and the latest developments in the fields of 3D wafer-level system integration, advanced packaging, and heterogeneous integration.

Visit us at SENSOR+TEST in Nuremberg from June 11 to 13, 2027! At the Fraunhofer joint booth, Fraunhofer IZM will present innovative hardware concepts and energy-efficient solutions for highly miniaturized sensor systems (green ICT) and radar sensor technology. We will also showcase the latest research results on advanced packaging, smart system integration, and photonics in thin glass at the panel/wafer level.

The Electronic Components and Technology Conference (ECTC) is one of the leading international events in the area of packaging, components, and microelectronic systems technology.

Fraunhofer IZM will be presenting technological highlights at PCIM 2027 (Power Conversion Intelligent Motion) in Nuremberg from June 11-13, 2027. The PCIM is the world's leading trade fair on the topics of power electronics, intelligent drive technology, renewable energies as well as energy management.

This year’s edition of the European 3D & Systems Summit will continue to explore the most relevant and advanced topics related to the 3D packaging roadmaps, heterogeneous integration and system-In-package (SiP) manufacturing.

The European Microelectronics & Packaging Conference (EMPC) is a prestigious event that focuses on the latest developments in electronic packaging technology. This year's conference will take place from September 14th to 16th, 2027, in Ingoldstadt.