Events

The VDE/VDI Society of Microelectronics, Microsystems and Precision Engineering (GMM), in conjunction with Fraunhofer IZM, will hold its sixth workshop within the PackMEMS event series on March 28 and 29. In 2019, the focus will be on packaging microsystems for medical applications.

Microsystems can be found in very different fields of use within medical engineering. These fields include diagnostics, treatment, logistics, telemedicine, and even ambient assisted living. Some areas of application place very specific demands on packaging. Implants, for instance, need suitable interfaces with the patient, and the circuit carriers must be adaptable to the limited, flexible, and moist “installation space” that is the human body. Outside of the body, too, special requirements are often applied to packaging technology. These particularities and challenges, and some solutions found to meet them, are at the forefront of this year's workshop.

The program will cover contributions from research and industry, giving an overview of the diverse challenges and opportunities offered by medical engineering, an area of use that is becoming more and more important to packaging.