Online event | Workshop Series  /  January 19, 2021, 4:00-4:45 p.m.

Controlling Warpage in Electronic System Integration Technologies

Speaker: Olaf Wittler

Intrinsic stresses and resulting warpage effects have a major impact on reliability during processing and the use phase of electronic components and assemblies.

For example, soldering of warped components can become impossible due to precision requirements in the assembly process. During a Fan-Out Wafer Level (FOWLP) process, excessive warpage can lead to problems in the RDL application. While embedding brittle components like ceramics, these can crack during temperature load.

The underlying issue of warpage and intrinsic stress cannot be erased due to the nature of different materials with different shrinkage being combined in electronic packages. But warpage can be predicted and controlled based on simulation and characterization.. Thus it does not have to be an issue of mystic surprise.

Fraunhofer IZM provides the full set of experience and methods in order to solve and avoid these issues. The expert session will give a brief introduction to this methodology to characterize, predict and minimize warpage effects.