Trainings and Workshops

Speaker: Oliver Kirsch

Latest trends in system integration and packaging are strongly aiming at heterogeneous, hybrid integration solutions such as co-packaging of electronics and optics and disaggregated system on-chip. In this webinar we will present a glass-based platform suitable for these integration strategies and show how our approach allows for a cost reduction compared to other material platforms (such as Si or SiN) as it is based on low-cost display glass which is available in large panel sizes (of up to 457 x 303 mm²) and commercial manufacturing equipment enabling high scalability.